| Numerical simulation of heat transfer cooling down by water in microgap structure | |
| Shen, Jiancheng[1]; Wen, Zhihui[2]; Zhang, Jinsong[3] | |
| 2015 | |
| 会议名称 | 16 int conf elect packaging technology |
| 会议日期 | 2015-01-01 |
| 关键词 | heat transfer microgap non boiling temperature distribution |
| 页码 | 1114-1119 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2240341 |
| 专题 | 上海大学 |
| 作者单位 | 1.[1]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. 2.[2]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. 3.[3]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Shen, Jiancheng[1],Wen, Zhihui[2],Zhang, Jinsong[3]. Numerical simulation of heat transfer cooling down by water in microgap structure[C]. 见:16 int conf elect packaging technology. 2015-01-01. |
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