Interfacial microstructure and high-temperature strength in silicon nitride/nickel-based superalloy bonding | |
Lan, Liang[1]; Ren, Zhongming[2]; Yu, Jianbo[3]; Li, Chuanjun[4]; Zhong, Yunbo[5] | |
刊名 | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
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2016 | |
卷号 | 30页码:1430-1440 |
关键词 | microstructure interface high-temperature strength joints Silicon nitride |
ISSN号 | 0169-4243 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2236214 |
专题 | 上海大学 |
作者单位 | 1.[1]Shanghai Univ, State Key Lab Adv Special Steels, Shanghai, Peoples R China. 2.[2]Shanghai Univ, State Key Lab Adv Special Steels, Shanghai, Peoples R China. 3.[3]Shanghai Univ, State Key Lab Adv Special Steels, Shanghai, Peoples R China. 4.[4]Shanghai Univ, State Key Lab Adv Special Steels, Shanghai, Peoples R China. 5.[5]Shanghai Univ, State Key Lab Adv Special Steels, Shanghai, Peoples R China. |
推荐引用方式 GB/T 7714 | Lan, Liang[1],Ren, Zhongming[2],Yu, Jianbo[3],et al. Interfacial microstructure and high-temperature strength in silicon nitride/nickel-based superalloy bonding[J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY,2016,30:1430-1440. |
APA | Lan, Liang[1],Ren, Zhongming[2],Yu, Jianbo[3],Li, Chuanjun[4],&Zhong, Yunbo[5].(2016).Interfacial microstructure and high-temperature strength in silicon nitride/nickel-based superalloy bonding.JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY,30,1430-1440. |
MLA | Lan, Liang[1],et al."Interfacial microstructure and high-temperature strength in silicon nitride/nickel-based superalloy bonding".JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY 30(2016):1430-1440. |
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