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	Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
	Sun, Shuangxi[1]; Chen, Si[2]; Luo, Xin[3]; Fu, Yifeng[4]; Ye, Lilei[5]; Liu, Johan[6]
刊名	MICROELECTRONICS RELIABILITY
	2016
卷号	56页码:129-135
关键词	Nano-TIM Nano-fiber Microelectronic packaging
ISSN号	0026-2714
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2235378
专题	上海大学
作者单位	1.[1]Shanghai Univ, Key Lab Adv Display & Syst Applicat, Sch Automat & Mech Engn, SMIT Ctr, 20 Chengzhong Rd,2nd Floor,Chem Bldg, Shanghai 201800, Peoples R China. 2.Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden. 3.[2]Shanghai Univ, Key Lab Adv Display & Syst Applicat, Sch Automat & Mech Engn, SMIT Ctr, 20 Chengzhong Rd,2nd Floor,Chem Bldg, Shanghai 201800, Peoples R China. 4.Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden. 5.[3]Shanghai Univ, Key Lab Adv Display & Syst Applicat, Sch Automat & Mech Engn, SMIT Ctr, 20 Chengzhong Rd,2nd Floor,Chem Bldg, Shanghai 201800, Peoples R China. 6.Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden. 7.[4]Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden. 8.SHT Smart High Tech AB, Aschebergsgatan 46, S-41133 Gothenburg, Sweden. 9.[5]SHT Smart High Tech AB, Aschebergsgatan 46, S-41133 Gothenburg, Sweden. 10.[6]Shanghai Univ, Key Lab Adv Display & Syst Applicat, Sch Automat & Mech Engn, SMIT Ctr, 20 Chengzhong Rd,2nd Floor,Chem Bldg, Shanghai 201800, Peoples R China.
推荐引用方式 GB/T 7714	Sun, Shuangxi[1],Chen, Si[2],Luo, Xin[3],et al. Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging[J]. MICROELECTRONICS RELIABILITY,2016,56:129-135.
APA	Sun, Shuangxi[1],Chen, Si[2],Luo, Xin[3],Fu, Yifeng[4],Ye, Lilei[5],&Liu, Johan[6].(2016).Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging.MICROELECTRONICS RELIABILITY,56,129-135.
MLA	Sun, Shuangxi[1],et al."Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging".MICROELECTRONICS RELIABILITY 56(2016):129-135.

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