Integrated Manufacturing of Microphone-array Node for Wireless Sensor Network (WSN) | |
Xu, Gaowei[1]; Gai, Wei[2]; Zheng, Tao[3]; Liang, Defeng[4]; Luo, Le[5]; Chen, Juying[6] | |
2016 | |
会议名称 | 17th International Conference on Electronic Packaging Technology (ICEPT) |
会议日期 | 2016-08-16 |
关键词 | System integration system in package (SiP) stacked interconnection MEMS microphone integration node |
页码 | 919-922 |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2235049 |
专题 | 上海大学 |
作者单位 | 1.[1]Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai, Peoples R China. 2.[2]Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai, Peoples R China. 3.[3]Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai, Peoples R China. 4.[4]Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai, Peoples R China. 5.Shanghai Univ, Dept Phys, Shanghai, Peoples R China. 6.[5]Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai, Peoples R China. 7.[6]Shanghai Huahong Grace Semicond Mfg Corp, Shanghai, Peoples R China. |
推荐引用方式 GB/T 7714 | Xu, Gaowei[1],Gai, Wei[2],Zheng, Tao[3],et al. Integrated Manufacturing of Microphone-array Node for Wireless Sensor Network (WSN)[C]. 见:17th International Conference on Electronic Packaging Technology (ICEPT). 2016-08-16. |
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