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	Minimum Thermal Conductivity in Weak Topological Insulators with Bismuth-Based Stack Structure
	Wei, Ping[1]; Yang, Jiong[2]; Guo, Liang[3]; Wang, Shanyu[4]; Wu, Lihua[5]; Xu, Xianfan[6]; Zhao, Wenyu[7]; Zhang, Qingjie[8]; Zhang, Wenqing[9]; Dresselhaus, Mildred S.[10]
刊名	ADVANCED FUNCTIONAL MATERIALS
	2016
卷号	26页码:5360-5367
ISSN号	1616-301X
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2233413
专题	上海大学
作者单位	1.[1]Univ Washington, Dept Mat Sci & Engn, Seattle, WA 98195 USA. 2.Wuhan Univ Technol, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Peoples R China. 3.[2]Univ Washington, Dept Mat Sci & Engn, Seattle, WA 98195 USA. 4.Shanghai Univ, Mat Genome Inst, Shanghai 200444, Peoples R China. 5.[3]Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA.,Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USA. 6.[4]Univ Washington, Dept Mat Sci & Engn, Seattle, WA 98195 USA. 7.[5]Univ Washington, Dept Mat Sci & Engn, Seattle, WA 98195 USA. 8.Shanghai Univ, Mat Genome Inst, Shanghai 200444, Peoples R China. 9.[6]Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA.,Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USA. 10.[7]Wuhan Univ Technol, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Peoples R China.
推荐引用方式 GB/T 7714	Wei, Ping[1],Yang, Jiong[2],Guo, Liang[3],et al. Minimum Thermal Conductivity in Weak Topological Insulators with Bismuth-Based Stack Structure[J]. ADVANCED FUNCTIONAL MATERIALS,2016,26:5360-5367.
APA	Wei, Ping[1].,Yang, Jiong[2].,Guo, Liang[3].,Wang, Shanyu[4].,Wu, Lihua[5].,...&Yang, Jihui[11].(2016).Minimum Thermal Conductivity in Weak Topological Insulators with Bismuth-Based Stack Structure.ADVANCED FUNCTIONAL MATERIALS,26,5360-5367.
MLA	Wei, Ping[1],et al."Minimum Thermal Conductivity in Weak Topological Insulators with Bismuth-Based Stack Structure".ADVANCED FUNCTIONAL MATERIALS 26(2016):5360-5367.

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