Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis | |
Xiao, Yanyi[1]; Wang, Wen[2]; Zhang, Jianhua[3] | |
刊名 | JOURNAL OF ELECTRONIC PACKAGING |
2016 | |
卷号 | 138 |
ISSN号 | 1043-7398 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2233267 |
专题 | 上海大学 |
作者单位 | 1.[1]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai 200072, Peoples R China. 2.[2]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai 200072, Peoples R China. 3.[3]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai 200072, Peoples R China. |
推荐引用方式 GB/T 7714 | Xiao, Yanyi[1],Wang, Wen[2],Zhang, Jianhua[3]. Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis[J]. JOURNAL OF ELECTRONIC PACKAGING,2016,138. |
APA | Xiao, Yanyi[1],Wang, Wen[2],&Zhang, Jianhua[3].(2016).Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis.JOURNAL OF ELECTRONIC PACKAGING,138. |
MLA | Xiao, Yanyi[1],et al."Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis".JOURNAL OF ELECTRONIC PACKAGING 138(2016). |
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