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	Application of multi-fidelity simulation modelling to integrated circuit packaging
	Hsieh, Liam Y.[1]; Huang, Edward[2]; Chen, Chun-Hung[3]; Zhang, Si[4]; Chang, Kuo-Hao[5]
刊名	International Journal of Simulation and Process Modelling
	2016
卷号	11页码:259-269
ISSN号	17402123
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2229694
专题	上海大学
作者单位	[1]Department of Systems Engineering and Operations Research, George Mason University, Fairfax, VA, 22030, United States [2]Department of Systems Engineering and Operations Research, George Mason University, Fairfax, VA, 22030, United States [3]Department of Systems Engineering and Operations Research, George Mason University, Fairfax, VA, 22030, United States [4]Department of Management Science and Engineering, Shanghai University, Shanghai, 200444, China [5]Department of Industrial Engineering and Engineering Management, National Tsing Hua University, Hsinchu, 30010, Taiwan
推荐引用方式 GB/T 7714	Hsieh, Liam Y.[1],Huang, Edward[2],Chen, Chun-Hung[3],et al. Application of multi-fidelity simulation modelling to integrated circuit packaging[J]. International Journal of Simulation and Process Modelling,2016,11:259-269.
APA	Hsieh, Liam Y.[1],Huang, Edward[2],Chen, Chun-Hung[3],Zhang, Si[4],&Chang, Kuo-Hao[5].(2016).Application of multi-fidelity simulation modelling to integrated circuit packaging.International Journal of Simulation and Process Modelling,11,259-269.
MLA	Hsieh, Liam Y.[1],et al."Application of multi-fidelity simulation modelling to integrated circuit packaging".International Journal of Simulation and Process Modelling 11(2016):259-269.

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