QQ客服 官方微博 反馈留言

	Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints
	Yan, Xingchen[1]; Xu, Kexin[2]; Wang, Junjie[3]; Wei, Xicheng[4]; Wang, Wurong[5]
刊名	SOLDERING & SURFACE MOUNT TECHNOLOGY
	2016
卷号	28页码:215-221
关键词	Microstructure IMC Ni-P plating SAC0307 Thermal aging Doping
ISSN号	0954-0911
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2229687
专题	上海大学
作者单位	1.[1]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 2.[2]China Leihua Elect Technol Res Inst, Wuxi, Peoples R China. 3.[3]Shanghai Automobile Gear Works, Shanghai, Peoples R China. 4.[4]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 5.[5]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China.
推荐引用方式 GB/T 7714	Yan, Xingchen[1],Xu, Kexin[2],Wang, Junjie[3],et al. Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2016,28:215-221.
APA	Yan, Xingchen[1],Xu, Kexin[2],Wang, Junjie[3],Wei, Xicheng[4],&Wang, Wurong[5].(2016).Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints.SOLDERING & SURFACE MOUNT TECHNOLOGY,28,215-221.
MLA	Yan, Xingchen[1],et al."Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints".SOLDERING & SURFACE MOUNT TECHNOLOGY 28(2016):215-221.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。