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	Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process (EI收录SCI收录)
	Tang, Y.[1,2]; Li, G.Y.[1]; Pan, Y.C.[1]
刊名	Journal of Alloys and Compounds
	2013
卷号	554页码:195-203
关键词	Adsorption Curve fitting Energy dispersive spectroscopy Grain growth Grain size and shape Growth kinetics Intermetallics Kinetics Nanoparticles Ostwald ripening Reaction kinetics Scanning electron microscopy Soldered joints Soldering Soldering alloys Tin Titanium dioxide X ray diffraction analysis
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2221199
专题	华南理工大学
作者单位	1.[1] School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China 2.[2] School of Information, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
推荐引用方式 GB/T 7714	Tang, Y.[1,2],Li, G.Y.[1],Pan, Y.C.[1]. Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process (EI收录SCI收录)[J]. Journal of Alloys and Compounds,2013,554:195-203.
APA	Tang, Y.[1,2],Li, G.Y.[1],&Pan, Y.C.[1].(2013).Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process (EI收录SCI收录).Journal of Alloys and Compounds,554,195-203.
MLA	Tang, Y.[1,2],et al."Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process (EI收录SCI收录)".Journal of Alloys and Compounds 554(2013):195-203.

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