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	The multi-functional stack design of a molybdenum back contact prepared by pulsed DC magnetron sputtering (EI收录)
	Huang, Yunxiang[1]; Gao, Shoushuai[2]; Tang, Yong[1]; Ao, Jianping[2]; Yuan, Wei[1]; Lu, Longsheng[1]
刊名	Thin Solid Films
	2016
卷号	616页码:820-827
关键词	Adhesion Compressive stress Copper Deposition Electrodeposition Electrodes Film thickness Interfaces (materials) Magnetron sputtering Microstructure Molybdenum Molybdenum plating Semiconducting selenium compounds Sputtering Tensile stress
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2198117
专题	华南理工大学
作者单位	1.[1] Key Laboratory of Surface Functional Structure Manufacturing of Guangdong Higher Education Institutes, South China University of Technology, Guangzhou 2.510640, China 3.[2] Institute of Photoelectronic Thin Film Devices and Technology, NanKai University, Tianjin 4.300071, China
推荐引用方式 GB/T 7714	Huang, Yunxiang[1],Gao, Shoushuai[2],Tang, Yong[1],等. The multi-functional stack design of a molybdenum back contact prepared by pulsed DC magnetron sputtering (EI收录)[J]. Thin Solid Films,2016,616:820-827.
APA	Huang, Yunxiang[1],Gao, Shoushuai[2],Tang, Yong[1],Ao, Jianping[2],Yuan, Wei[1],&Lu, Longsheng[1].(2016).The multi-functional stack design of a molybdenum back contact prepared by pulsed DC magnetron sputtering (EI收录).Thin Solid Films,616,820-827.
MLA	Huang, Yunxiang[1],et al."The multi-functional stack design of a molybdenum back contact prepared by pulsed DC magnetron sputtering (EI收录)".Thin Solid Films 616(2016):820-827.

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