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Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging
He, Piaopiao[1]; Zhang, Jinlong[2]; Zhang, Jianhua[3]; Yin, Luqiao[4]
刊名ADVANCES IN MATERIALS SCIENCE AND ENGINEERING
2017
卷号2017
ISSN号1687-8434
URL标识查看原文
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/2188720
专题上海大学
作者单位1.[1]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China.
2.[2]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China.
3.Shanghai Univ, Sch Mech Engn & Automat, Shanghai 200072, Peoples R China.
4.[3]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China.
5.Shanghai Univ, Sch Mech Engn & Automat, Shanghai 200072, Peoples R China.
6.[4]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China.
7.Shanghai Univ, Sch Mech Engn & Automat, Shanghai 200072, Peoples R China.
推荐引用方式
GB/T 7714
He, Piaopiao[1],Zhang, Jinlong[2],Zhang, Jianhua[3],et al. Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging[J]. ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,2017,2017.
APA He, Piaopiao[1],Zhang, Jinlong[2],Zhang, Jianhua[3],&Yin, Luqiao[4].(2017).Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging.ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,2017.
MLA He, Piaopiao[1],et al."Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging".ADVANCES IN MATERIALS SCIENCE AND ENGINEERING 2017(2017).
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