Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging | |
He, Piaopiao[1]; Zhang, Jinlong[2]; Zhang, Jianhua[3]; Yin, Luqiao[4] | |
刊名 | ADVANCES IN MATERIALS SCIENCE AND ENGINEERING
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2017 | |
卷号 | 2017 |
ISSN号 | 1687-8434 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2188720 |
专题 | 上海大学 |
作者单位 | 1.[1]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 2.[2]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 3.Shanghai Univ, Sch Mech Engn & Automat, Shanghai 200072, Peoples R China. 4.[3]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 5.Shanghai Univ, Sch Mech Engn & Automat, Shanghai 200072, Peoples R China. 6.[4]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 7.Shanghai Univ, Sch Mech Engn & Automat, Shanghai 200072, Peoples R China. |
推荐引用方式 GB/T 7714 | He, Piaopiao[1],Zhang, Jinlong[2],Zhang, Jianhua[3],et al. Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging[J]. ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,2017,2017. |
APA | He, Piaopiao[1],Zhang, Jinlong[2],Zhang, Jianhua[3],&Yin, Luqiao[4].(2017).Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging.ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,2017. |
MLA | He, Piaopiao[1],et al."Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging".ADVANCES IN MATERIALS SCIENCE AND ENGINEERING 2017(2017). |
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