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	Multi-temperature indentation creep tests on nanotwinned copper
	Yang, Xu-Sheng[1]; Zhai, Hui-Ru[2]; Ruan, Hai-Hui[3]; Shi, San-Qiang[4]; Zhang, Tong-Yi[5]
刊名	INTERNATIONAL JOURNAL OF PLASTICITY
	2018
卷号	104页码:68-79
关键词	Nanotwin Indentation creep Creep activation parameters Twin boundary migration Hardness
ISSN号	0749-6419
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2175353
专题	上海大学
作者单位	1.[1]Hong Kong Polytech Univ, Dept Ind & Syst Engn, Kowloon, Hong Kong, Peoples R China. 2.[2]Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R China. 3.[3]Hong Kong Polytech Univ, Dept Mech Engn, Kowloon, Hong Kong, Peoples R China. 4.[4]Hong Kong Polytech Univ, Dept Mech Engn, Kowloon, Hong Kong, Peoples R China. 5.Hong Kong Polytech Univ, Shenzhen Res Inst, Shenzhen, Peoples R China. 6.[5]Shanghai Univ, Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.,Shanghai Univ, Shanghai Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
推荐引用方式 GB/T 7714	Yang, Xu-Sheng[1],Zhai, Hui-Ru[2],Ruan, Hai-Hui[3],et al. Multi-temperature indentation creep tests on nanotwinned copper[J]. INTERNATIONAL JOURNAL OF PLASTICITY,2018,104:68-79.
APA	Yang, Xu-Sheng[1],Zhai, Hui-Ru[2],Ruan, Hai-Hui[3],Shi, San-Qiang[4],&Zhang, Tong-Yi[5].(2018).Multi-temperature indentation creep tests on nanotwinned copper.INTERNATIONAL JOURNAL OF PLASTICITY,104,68-79.
MLA	Yang, Xu-Sheng[1],et al."Multi-temperature indentation creep tests on nanotwinned copper".INTERNATIONAL JOURNAL OF PLASTICITY 104(2018):68-79.

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