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	Fabrication of SiC preform for SiC/Al composite in electronic packaging (EI收录)
	Huang, Qiang[1]; Zhang, Guohua[1]; Ding, Rongzheng[1]; Guo, Daqi[1]; Gu, Mingyuan[2]
会议名称	ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings
会议日期	October 28, 2003 - October 30, 2003
会议地点	Shanghai, China
关键词	Electronics packaging Fabrication Particle size Powders Preforming Rheology Shear deformation Shear thinning Silicon carbide Solids Testing Viscosity
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2140292
专题	华南理工大学
作者单位	1.[1] Packaging Research Center, Wuxi Microelectronics Institute, Wuxi, China 2.[2] State Key Lab. of MMCs, Shanghai Jiaotong University, Shanghai, China
推荐引用方式 GB/T 7714	Huang, Qiang[1],Zhang, Guohua[1],Ding, Rongzheng[1],等. Fabrication of SiC preform for SiC/Al composite in electronic packaging (EI收录)[C]. 见:ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings. Shanghai, China. October 28, 2003 - October 30, 2003.

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