QQ客服 官方微博 反馈留言

	Dielectric properties of Ag@SiO2/epoxy composite for embedded capacitor applications (EI收录)
	Liang, Xianwen[1,2,3]; Yua, Shuhui[1]; Luo, Suibin[1,2,3]; Zhuang, Zhiqiang[2,3]; Rong, Sun[1]
会议名称	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
会议日期	August 16, 2010 - August 19, 2010
会议地点	Xi'an, China
关键词	Coatings Composite films Electronics packaging Epoxy resins Packaging Permittivity Silicon compounds Solvents Synthetic resins Tanning
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2064928
专题	华南理工大学
作者单位	1.[1] Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen University, 1068 Xueyuan Avenue, Shenzhen 518067, China 2.[2] College of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China 3.[3] Wushan RD., Tianhe District, Guangzhou 510641, China
推荐引用方式 GB/T 7714	Liang, Xianwen[1,2,3],Yua, Shuhui[1],Luo, Suibin[1,2,3],等. Dielectric properties of Ag@SiO2/epoxy composite for embedded capacitor applications (EI收录)[C]. 见:Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Xi'an, China. August 16, 2010 - August 19, 2010.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。