| Comparison of Wettability for Sn-based Solders on Copper and Aluminum Substrates (CPCI-S收录) | |
| Yin, Limeng[1]; Xian, Jianwei[2]; Yao, Zongxiang[1] | |
| 会议名称 | FUNCTIONAL AND ELECTRONIC MATERIALS |
| 关键词 | Sn-based solder Wettability Wetting balance method Aluminum substrate |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2061723 |
| 专题 | 华南理工大学 |
| 作者单位 | 1.[1]Chongqing Univ Sci & Technol, Sch Met & Mat Engn, Chongqing 401331, Peoples R China 2.[2]South China Univ Technol, Sch Mat Sci & Engn, Guangzhou 510640, Peoples R China |
| 推荐引用方式 GB/T 7714 | Yin, Limeng[1],Xian, Jianwei[2],Yao, Zongxiang[1]. Comparison of Wettability for Sn-based Solders on Copper and Aluminum Substrates (CPCI-S收录)[C]. 见:FUNCTIONAL AND ELECTRONIC MATERIALS. |
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