Design of multi-band microstrip power dividers (EI收录) | |
Chu, Qing-Xin[1]; Lin, Feng[1] | |
会议名称 | 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 |
会议日期 | December 12, 2011 - December 14, 2011 |
会议地点 | Hanzhou, China |
关键词 | Design Electric lines Packaging Voltage dividers |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2060709 |
专题 | 华南理工大学 |
作者单位 | [1] School of Electronic and Information Engineering, South China University of Technology, Guangzhou, Guangdong, 510640, China |
推荐引用方式 GB/T 7714 | Chu, Qing-Xin[1],Lin, Feng[1]. Design of multi-band microstrip power dividers (EI收录)[C]. 见:2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. Hanzhou, China. December 12, 2011 - December 14, 2011. |
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