| Thermal stress analysis and structure parameter selection for a Bi 2Te3-based thermoelectric module (EI收录) | |
| Gao, Jun-Ling[1,2]; Du, Qun-Gui[1]; Zhang, Xiao-Dan[1]; Jiang, Xin-Qiang[1] | |
| 会议名称 | Journal of Electronic Materials |
| 关键词 | Bismuth Conversion efficiency Electric conductivity Equivalent circuits Finite element method Mechanical properties Stress analysis Stress concentration Thermal stress Thermoelasticity Thermoelectric equipment Thermoelectricity |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2058662 |
| 专题 | 华南理工大学 |
| 作者单位 | 1.[1] School of Mechanical and Auto Engineering, South China University of Technology, Wushan RD, Tianhe District, Guangzhou 510641, China 2.[2] Hebei University of Science and Technology, Yuhua East RD, Shijiazhuang 050018, China |
| 推荐引用方式 GB/T 7714 | Gao, Jun-Ling[1,2],Du, Qun-Gui[1],Zhang, Xiao-Dan[1],等. Thermal stress analysis and structure parameter selection for a Bi 2Te3-based thermoelectric module (EI收录)[C]. 见:Journal of Electronic Materials. |
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