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	Three-dimensional finite element analysis of mechanical and fracture behavior of micro-scale BGA structure solder joints containing cracks in (EI收录)
	Qin, Hong-Bo[1]; Zhang, Xin-Ping[1]
会议名称	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
会议日期	August 13, 2012 - August 16, 2012
会议地点	Guilin, China
关键词	Brittle fracture Contact angle Crack tips Cracks Electronics packaging Finite element method Soldering alloys Stress intensity factors
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2054759
专题	华南理工大学
作者单位	[1] School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China
推荐引用方式 GB/T 7714	Qin, Hong-Bo[1],Zhang, Xin-Ping[1]. Three-dimensional finite element analysis of mechanical and fracture behavior of micro-scale BGA structure solder joints containing cracks in (EI收录)[C]. 见:ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. Guilin, China. August 13, 2012 - August 16, 2012.

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