| Effects of Pb Content on Solidification Behavior and Microstructure on Mixed Solder Alloy (CPCI-S收录) | |
| Wei Xiongfeng[1,2]; Li Xunping[2]; Zhoubin[2]; Wei Guoqiang[1] | |
| 会议名称 | 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 关键词 | mixed solder alloy Pb content Sn-Ag-Pb eutectic phase solidification behavior microstructure |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2050472 |
| 专题 | 华南理工大学 |
| 作者单位 | 1.[1]S China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510641, Guangdong, Peoples R China 2.[2]Sci & Technol Reliabil Phys, Appl Elect component Lab, Guangzhou, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wei Xiongfeng[1,2],Li Xunping[2],Zhoubin[2],等. Effects of Pb Content on Solidification Behavior and Microstructure on Mixed Solder Alloy (CPCI-S收录)[C]. 见:2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). |
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