Electrochemical evaluation of allyl thiourea layers on copper surface. | |
Tang, L.N.; Wang, F.P. | |
刊名 | Corrosion Science |
2008 | |
卷号 | Vol.50 No.4页码:1156-1160 |
关键词 | MONOMOLECULAR films SURFACE chemistry SEPARATION (Technology) COPPER oxide METALLIC oxides INTERMEDIATES (Chemistry) |
ISSN号 | 0010-938X |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/1856217 |
专题 | 辽宁师范大学 |
作者单位 | Faculty of Chemistry and Chemical Engineering, Liaoning Normal University, Dalian 116029, China |
推荐引用方式 GB/T 7714 | Tang, L.N.,Wang, F.P.. Electrochemical evaluation of allyl thiourea layers on copper surface.[J]. Corrosion Science,2008,Vol.50 No.4:1156-1160. |
APA | Tang, L.N.,&Wang, F.P..(2008).Electrochemical evaluation of allyl thiourea layers on copper surface..Corrosion Science,Vol.50 No.4,1156-1160. |
MLA | Tang, L.N.,et al."Electrochemical evaluation of allyl thiourea layers on copper surface.".Corrosion Science Vol.50 No.4(2008):1156-1160. |
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