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Electrochemical evaluation of allyl thiourea layers on copper surface.
Tang, L.N.; Wang, F.P.
刊名Corrosion Science
2008
卷号Vol.50 No.4页码:1156-1160
关键词MONOMOLECULAR films SURFACE chemistry SEPARATION (Technology) COPPER oxide METALLIC oxides INTERMEDIATES (Chemistry)
ISSN号0010-938X
URL标识查看原文
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/1856217
专题辽宁师范大学
作者单位Faculty of Chemistry and Chemical Engineering, Liaoning Normal University, Dalian 116029, China
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GB/T 7714
Tang, L.N.,Wang, F.P.. Electrochemical evaluation of allyl thiourea layers on copper surface.[J]. Corrosion Science,2008,Vol.50 No.4:1156-1160.
APA Tang, L.N.,&Wang, F.P..(2008).Electrochemical evaluation of allyl thiourea layers on copper surface..Corrosion Science,Vol.50 No.4,1156-1160.
MLA Tang, L.N.,et al."Electrochemical evaluation of allyl thiourea layers on copper surface.".Corrosion Science Vol.50 No.4(2008):1156-1160.
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