Squeeze-film Effects in MEMS Devices with Perforated Plates for Small Amplitude Vibration

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	Squeeze-film Effects in MEMS Devices with Perforated Plates for Small Amplitude Vibration
	Feng C(冯闯); Zhao YP(赵亚溥); Liu DQ(刘冬青)
刊名	Microsystem Technologies
	2007
卷号	13 期号:7 页码:625-633
ISSN号	0946-7076
中文摘要	Squeeze-film effects of perforated plates for small amplitude vibration are analyzed through modified Reynolds equation (MRE). The analytical analysis reckons in most important influential factors: compressibility of the air, border effects, and the resistance caused by vertical air flow passing through perforated holes. It is found that consideration of air compressibility is necessary for high operating frequency and small ratio of the plate width to the attenuation length. The analytical results presented in this paper agree with ANSYS simulation results better than that under the air incompressibility assumption. The analytical analysis can be used to estimate the squeeze-film effects causing damping and stiffness added to the system. Since the value of Reynolds number involved in this paper is low (< 1), inertial effects are neglected.
学科主题	力学
收录类别	SCI
语种	英语
WOS记录号	WOS:000246771800003
公开日期	2007-06-15
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/17164]
专题	力学研究所_力学所知识产出(1956-2008) 力学研究所_非线性力学国家重点实验室
推荐引用方式 GB/T 7714	Feng C,Zhao YP,Liu DQ. Squeeze-film Effects in MEMS Devices with Perforated Plates for Small Amplitude Vibration[J]. Microsystem Technologies,2007,13(7):625-633.
APA	Feng C,Zhao YP,&Liu DQ.(2007).Squeeze-film Effects in MEMS Devices with Perforated Plates for Small Amplitude Vibration.Microsystem Technologies,13(7),625-633.
MLA	Feng C,et al."Squeeze-film Effects in MEMS Devices with Perforated Plates for Small Amplitude Vibration".Microsystem Technologies 13.7(2007):625-633.