Reduction of Dynamic Multipole Content in Insertion Devices Using Flat Wires

	Reduction of Dynamic Multipole Content in Insertion Devices Using Flat Wires
	T.Y. Chung; S.D. Chen; M.-S. Chiu; S.J. Huang; C.-S. Hwang; J.C. Jan; C.Y. Kuo; Y.T. Li; C.Y. Wu
会议日期	2018
会议地点	Vancouver, BC, Canada
会议录	9th International Particle Accelerator Conference
内容类型	会议论文
源URL	[http://ir.ihep.ac.cn/handle/311005/267153]
专题	学术会议_国际参会_JaCoW高能所参会会议_IPAC
作者单位	NSRRC, Hsinchu, Taiwan
推荐引用方式 GB/T 7714	T.Y. Chung,S.D. Chen,M.-S. Chiu,et al. Reduction of Dynamic Multipole Content in Insertion Devices Using Flat Wires[C]. 见:. Vancouver, BC, Canada. 2018.