Comparison of Hydrogenated Bisphenol A and Bisphenol A Epoxies: Curing Behavior, Thermal and Mechanical Properties, Shape Memory Properties

CORC > 宁波材料技术与工程研究所 > 中国科学院宁波材料技术与工程研究所 > 2018专题

	Comparison of Hydrogenated Bisphenol A and Bisphenol A Epoxies: Curing Behavior, Thermal and Mechanical Properties, Shape Memory Properties
	Zhu, Jin; Wang, Sheng; Yue, Hong; Ma, Songqi; Wei, Jingjing
刊名	MACROMOLECULAR RESEARCH
	2018
卷号	26 期号:6 页码:529-538
关键词	Polyester Copolymer Glasses Secondary Relaxation Resin Polymers Composites Polyurethane Toughness Polysiloxane Elastomers Thermosets
英文摘要	Hydrogenated bisphenol A epoxy resin was cured using different kind of curing agents, resulting in epoxy networks with better shape memory properties than bisphenol A epoxy networks. The non-isothermal curing kinetics investigated by differential scanning calorimetry (DSC) demonstrated that hydrogenated bisphenol A epoxy showed lower curing reactivity than bisphenol A epoxy, while it still could be cured well. The thermal and mechanical properties as well as shape memory properties were studied by dynamic mechanical analysis (DMA), DSC, thermogravimetric analysis (TGA), three-point bending test and U-type shape memory test and cyclic stretch test using DMA. Results manifested that hydrogenated bisphenol A epoxy systems exhibited lower shape transition temperature (lower T (g) ), slightly higher modulus, better toughness, much faster shape recovery rate, and better elongating ability at temperature above T (g) than bisphenol A epoxy systems, which was due to the rigidity of cyclohexane ring from its steric hindrance and favorable segmental mobility when absorbing external energy such as heating or bending. Moreover, the shape fixity and shape recovery ratio of all the samples were as high as 96.398.5% and 100% and their cycling stability during shape memory test was excellent. Although lower than bisphenol A epoxy networks, hydrogenated bisphenol A epoxy networks possessed high thermal stability with initial degradation temperature (T (d5%)) of > 305 A degrees C.
学科主题	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
语种	英语
公开日期	2018-12-04
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/17437]
专题	2018专题
推荐引用方式 GB/T 7714	Zhu, Jin,Wang, Sheng,Yue, Hong,et al. Comparison of Hydrogenated Bisphenol A and Bisphenol A Epoxies: Curing Behavior, Thermal and Mechanical Properties, Shape Memory Properties[J]. MACROMOLECULAR RESEARCH,2018,26(6):529-538.
APA	Zhu, Jin,Wang, Sheng,Yue, Hong,Ma, Songqi,&Wei, Jingjing.(2018).Comparison of Hydrogenated Bisphenol A and Bisphenol A Epoxies: Curing Behavior, Thermal and Mechanical Properties, Shape Memory Properties.MACROMOLECULAR RESEARCH,26(6),529-538.
MLA	Zhu, Jin,et al."Comparison of Hydrogenated Bisphenol A and Bisphenol A Epoxies: Curing Behavior, Thermal and Mechanical Properties, Shape Memory Properties".MACROMOLECULAR RESEARCH 26.6(2018):529-538.