Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate | |
Wu, Xinzhou(吴馨洲); Shao, Shuangshuang(邵双双); Chen, Zheng(陈征); Cui, Zheng(崔铮); Chen Z(陈征) | |
刊名 | NANOTECHNOLOGY |
2017 | |
语种 | 英语 |
内容类型 | 期刊论文 |
源URL | [http://ir.sinano.ac.cn/handle/332007/5577] |
专题 | 苏州纳米技术与纳米仿生研究所_印刷电子学部_崔铮团队 |
通讯作者 | Chen Z(陈征) |
推荐引用方式 GB/T 7714 | Wu, Xinzhou,Shao, Shuangshuang,Chen, Zheng,et al. Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate[J]. NANOTECHNOLOGY,2017. |
APA | Wu, Xinzhou,Shao, Shuangshuang,Chen, Zheng,Cui, Zheng,&陈征.(2017).Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate.NANOTECHNOLOGY. |
MLA | Wu, Xinzhou,et al."Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate".NANOTECHNOLOGY (2017). |
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