Design of Hybrid Nanostructural Arrays to Manipulate SERS-Active Substrates by Nanosphere Lithography

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	Design of Hybrid Nanostructural Arrays to Manipulate SERS-Active Substrates by Nanosphere Lithography
	Zhao, X. Y.; J. H. Wen; M. N. Zhang; D. H. Wang; Y. W. L. Chen; L. Chen; Y. Zhang; J. Yang and Y. Dut
刊名	Acs Applied Materials & Interfaces
	2017
卷号	9 期号:8
英文摘要	An easy-handling and low-cost method is utilized to controllably fabricate nanopattern arrays as the surface-enhanced Raman scattering (SERS) active substrates with high density of SERS-active areas (hot spots). A hybrid silver array of nanocaps and nanotriangles are prepared by combining magnetron sputtering and plasma etching. By adjusting the etching time of polystyrene (PS) colloid spheres array in silver nanobowls, the morphology of the arrays can be easily manipulated to control the formation and distribution of hot spots. The experimental results show that the hybrid nanostructural arrays have large enhancement factor, which is estimated to be seven times larger than that in the array of nanocaps and three times larger than that in the array of nanorings and nanoparticles. According to the results of finite-difference time domain simulation, the excellent SERS performance of this array is ascribed to the high density of hot spots and enhanced electromagnetic field.
语种	英语
内容类型	期刊论文
源URL	[http://ir.ciomp.ac.cn/handle/181722/59478]
专题	长春光学精密机械与物理研究所_中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Zhao, X. Y.,J. H. Wen,M. N. Zhang,et al. Design of Hybrid Nanostructural Arrays to Manipulate SERS-Active Substrates by Nanosphere Lithography[J]. Acs Applied Materials & Interfaces,2017,9(8).
APA	Zhao, X. Y..,J. H. Wen.,M. N. Zhang.,D. H. Wang.,Y. W. L. Chen.,...&J. Yang and Y. Dut.(2017).Design of Hybrid Nanostructural Arrays to Manipulate SERS-Active Substrates by Nanosphere Lithography.Acs Applied Materials & Interfaces,9(8).
MLA	Zhao, X. Y.,et al."Design of Hybrid Nanostructural Arrays to Manipulate SERS-Active Substrates by Nanosphere Lithography".Acs Applied Materials & Interfaces 9.8(2017).