Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor

CORC > 长春光学精密机械与物理研究所 > 中国科学院长春光学精密机械与物理研究所 > 中科院长春光机所知识产出

	Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor
	Mao, S.; J. Liu and B. Ge
刊名	Hanjie Xuebao/Transactions of the China Welding Institution
	2017
卷号	38 期号:3
英文摘要	With the use of Pb in a variety of occasions prohibited, Lead-free technology becomes one of important research direction. For understanding the fatigue properties of lead-free solder, there is important significance to analyse fanalyse state of lead-free solders and to research on the method of testing. With the 0805 chip capacitor device package solder joints as the research object, Sn96.5/Ag3/Cu0.5 solder joints finite element model is established for multi period under temperature cycles. And shearing test is carried out. The value of Period-shearing stress to Sn96.5/Ag3/Cu0.5 and Sn63/Pb37 solders is obtained. Thermal fatigue fitting curves of solder in 1500 periods is acquired, by using nonlinear least square method to fit curves. The results indicates that under the stipulated test condition, in limited 1500 periods, thermal fatigue performance of Sn96.5/Ag3/Cu0.5 solder joints' rate of thermal fatigue deterioration to 0805 capacitance is slightly slower than that of Sn63/Pb37 solder joints. 2017, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
语种	中文
内容类型	期刊论文
源URL	[http://ir.ciomp.ac.cn/handle/181722/59135]
专题	长春光学精密机械与物理研究所_中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Mao, S.,J. Liu and B. Ge. Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor[J]. Hanjie Xuebao/Transactions of the China Welding Institution,2017,38(3).
APA	Mao, S.,&J. Liu and B. Ge.(2017).Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor.Hanjie Xuebao/Transactions of the China Welding Institution,38(3).
MLA	Mao, S.,et al."Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor".Hanjie Xuebao/Transactions of the China Welding Institution 38.3(2017).