The hole-filling method and the uniform multiscale computation of the elastic equations in perforated domains
Wang, X.; Cao, L.
刊名INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING
2008
卷号5期号:4页码:612-634
关键词homogenization multiscale analysis elastic equations perforated domain hole-filling method
ISSN号1705-5105
英文摘要In this paper, we discuss the boundary value problem for the linear elastic equations in a perforated domain Omega(epsilon). We fill all holes with a very compliant material, then we study the homogenization method and the multiscale analysis for the associated multiphase problem in a domain Omega without holes. We are interested in the asymptotic behavior of the solution for the multiphase problem as the material properties of one weak phase go to zero, which has a wide range of applications in shape optimization and in 3-D mesh generation. The main contribution obtained in this paper is to give a full mathematical justification for this limiting process in general senses. Finally, some numerical results are presented, which support strongly the theoretical results of this paper.
WOS研究方向Mathematics
语种英语
出版者ISCI-INST SCIENTIFIC COMPUTING & INFORMATION
WOS记录号WOS:000258036400005
内容类型期刊论文
源URL[http://ir.amss.ac.cn/handle/2S8OKBNM/6723]  
专题计算数学与科学工程计算研究所
通讯作者Wang, X.
作者单位Chinese Acad Sci, Acad Math & Syst Sci, Inst Computat Math & Sci Engn, State Key Lab Sci & Engn Comp, Beijing 100080, Peoples R China
推荐引用方式
GB/T 7714
Wang, X.,Cao, L.. The hole-filling method and the uniform multiscale computation of the elastic equations in perforated domains[J]. INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING,2008,5(4):612-634.
APA Wang, X.,&Cao, L..(2008).The hole-filling method and the uniform multiscale computation of the elastic equations in perforated domains.INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING,5(4),612-634.
MLA Wang, X.,et al."The hole-filling method and the uniform multiscale computation of the elastic equations in perforated domains".INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING 5.4(2008):612-634.
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