Surface morphology and roughness of Cu thin films prepared by ionized cluster beam deposition | |
Cao, Bo; Yang, Tongrui; Li, Gongping; Cho, Seong Jin; Kim, Hee | |
2012 | |
会议名称 | 2012 International Conference on Frontiers of Advanced Materials and Engineering Technology, FAMET 2012 |
会议日期 | January 4, 2012 - January 5, 2012 |
会议地点 | Xiamen, China |
关键词 | Surface morphology Atomic force microscopy Chemical modification Copper Deposition Engineering technology Ionization Ions Morphology Semiconducting silicon compounds Surface roughness Surfaces Thin films Vapor deposition Acceleration voltages Average grain size Cu Films Cu thin film Deposition conditions Ionized cluster beam deposition Ionized cluster beams P-type Si |
卷号 | 430-432 |
页码 | 419-422 |
通讯作者 | Cao, B. (caobo@ncepu.edu.cn) |
会议录 | Advanced Materials Research |
会议录出版地 | Clausthal-Zellerfeld |
学科主题 | Classical Physics; Relativity; Engineering Graphics; Engineering Standards; Engineering Profession;Chemical Operations; Materials Science;Chemical Reactions; Chemistry |
语种 | 英语 |
ISSN号 | 1022-6680 |
内容类型 | 会议论文 |
源URL | [http://ir.lzu.edu.cn/handle/262010/184912] |
专题 | 核科学与技术学院_会议论文 |
推荐引用方式 GB/T 7714 | Cao, Bo,Yang, Tongrui,Li, Gongping,et al. Surface morphology and roughness of Cu thin films prepared by ionized cluster beam deposition[C]. 见:2012 International Conference on Frontiers of Advanced Materials and Engineering Technology, FAMET 2012. Xiamen, China. January 4, 2012 - January 5, 2012. |
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