Improving the Thermal Stability of Cu3N Films by Addition of Mn | |
Fan, XY; Li, ZJ; Meng, A; Li, C; Wu, ZG; Yan, PX | |
刊名 | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY |
2015-08 | |
卷号 | 31期号:8页码:822-827 |
关键词 | Magnetron sputtering Cu3N film Mn-doped Thermal stability |
ISSN号 | 1005-0302 |
通讯作者 | Li, C (reprint author), Ocean Univ China, Dept Phys, Qingdao 266100, Peoples R China. |
学科主题 | Materials Science; Metallurgy & Metallurgical Engineering |
语种 | 英语 |
WOS记录号 | WOS:000359495200007 |
内容类型 | 期刊论文 |
源URL | [http://ir.lzu.edu.cn/handle/262010/181291] |
专题 | 物理科学与技术学院_期刊论文 |
推荐引用方式 GB/T 7714 | Fan, XY,Li, ZJ,Meng, A,et al. Improving the Thermal Stability of Cu3N Films by Addition of Mn[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2015,31(8):822-827. |
APA | Fan, XY,Li, ZJ,Meng, A,Li, C,Wu, ZG,&Yan, PX.(2015).Improving the Thermal Stability of Cu3N Films by Addition of Mn.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,31(8),822-827. |
MLA | Fan, XY,et al."Improving the Thermal Stability of Cu3N Films by Addition of Mn".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 31.8(2015):822-827. |
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