Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC | |
Yu, HL; Zhang, XF; Shen, HJ; Tang, YD; Bai, Y; Wu, YD; Liu, K; Liu, XY | |
刊名 | JOURNAL OF APPLIED PHYSICS
![]() |
2015-01-14 | |
卷号 | 117期号:2页码:- |
ISSN号 | 0021-8979 |
通讯作者 | Shen, HJ (reprint author), Chinese Acad Sci, Inst Microelect, Microwave Device & IC Dept, Beijing 100029, Peoples R China. |
学科主题 | Physics |
语种 | 英语 |
WOS记录号 | WOS:000348129300070 |
内容类型 | 期刊论文 |
源URL | [http://ir.lzu.edu.cn/handle/262010/126687] ![]() |
专题 | 物理科学与技术学院_期刊论文 |
推荐引用方式 GB/T 7714 | Yu, HL,Zhang, XF,Shen, HJ,et al. Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC[J]. JOURNAL OF APPLIED PHYSICS,2015,117(2):-. |
APA | Yu, HL.,Zhang, XF.,Shen, HJ.,Tang, YD.,Bai, Y.,...&Liu, XY.(2015).Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC.JOURNAL OF APPLIED PHYSICS,117(2),-. |
MLA | Yu, HL,et al."Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC".JOURNAL OF APPLIED PHYSICS 117.2(2015):-. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论