Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC

	Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC
	Yu, HL; Zhang, XF; Shen, HJ; Tang, YD; Bai, Y; Wu, YD; Liu, K; Liu, XY
刊名	JOURNAL OF APPLIED PHYSICS
	2015-01-14
卷号	117 期号:2 页码:-
ISSN号	0021-8979
通讯作者	Shen, HJ (reprint author), Chinese Acad Sci, Inst Microelect, Microwave Device & IC Dept, Beijing 100029, Peoples R China.
学科主题	Physics
语种	英语
WOS记录号	WOS:000348129300070
内容类型	期刊论文
源URL	[http://ir.lzu.edu.cn/handle/262010/126687]
专题	物理科学与技术学院_期刊论文
推荐引用方式 GB/T 7714	Yu, HL,Zhang, XF,Shen, HJ,et al. Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC[J]. JOURNAL OF APPLIED PHYSICS,2015,117(2):-.
APA	Yu, HL.,Zhang, XF.,Shen, HJ.,Tang, YD.,Bai, Y.,...&Liu, XY.(2015).Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC.JOURNAL OF APPLIED PHYSICS,117(2),-.
MLA	Yu, HL,et al."Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC".JOURNAL OF APPLIED PHYSICS 117.2(2015):-.