Undercut structures fabricated by microtransfer printing combined with UV exposure and their applications

	Undercut structures fabricated by microtransfer printing combined with UV exposure and their applications
	Xing RB ; Xuan Y ; Wang Z ; Ma DG ; Han YC
刊名	current applied physics
	2009
卷号	9 期号:4 页码:760-763
关键词	LIGHT-EMITTING-DIODES PASSIVE-MATRIX DISPLAY
ISSN号	1567-1739
通讯作者	ma dg
中文摘要	in this paper. the undercut structures were fabricated by microtransfer printing of metal films on the surface of photoresist combined with uv exposure and photoresist film developing. the patterned metal films were used as mask to realize the selective uv exposure of photoresist firstly. the undercut structures. which consist of the top metal films and the patterned bottom photoresist, formed in the subsequent developing process because of the lateral dissolving of photoresist at the edge of the unexposed regions. the method proposed in this paper has wider tolerance to the changing of the patterning parameters. but, without effect on patterning resolution since the metal film was used as the top layer. the undercut structures were used as separators to pattern passive-matrix display of organic light-emitting diodes (oleds). no visible difference of the device performance was observed compared with the oleds patterned by the shadow mask.
收录类别	SCI
语种	英语
WOS记录号	WOS:000264737400010
公开日期	2010-05-28
内容类型	期刊论文
源URL	[http://202.98.16.49/handle/322003/12557]
专题	长春应用化学研究所_长春应用化学研究所知识产出_期刊论文
推荐引用方式 GB/T 7714	Xing RB,Xuan Y,Wang Z,et al. Undercut structures fabricated by microtransfer printing combined with UV exposure and their applications[J]. current applied physics,2009,9(4):760-763.
APA	Xing RB,Xuan Y,Wang Z,Ma DG,&Han YC.(2009).Undercut structures fabricated by microtransfer printing combined with UV exposure and their applications.current applied physics,9(4),760-763.
MLA	Xing RB,et al."Undercut structures fabricated by microtransfer printing combined with UV exposure and their applications".current applied physics 9.4(2009):760-763.