Electrical leakage through thin PDMS microchannel walls and its applications

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	Electrical leakage through thin PDMS microchannel walls and its applications
	Sun JS; Vajandar SK; Xu DY; Kang YJ; Li DQ; Li DY; Hu GQ(胡国庆)
	2009
会议名称	2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008
会议日期	October 31, 2008 - November 6, 2008
会议地点	Boston, MA, United states
关键词	Channel wall Electrical field Electrical leakage Electroosmotic flow Electroosmotic velocity Electrophoretic migration Experimental characterization Individual particles Insulated boundary Microfluidic channel Microfluidic circuit Microfluidic networks Numerical modeling PDMS microchannels
通讯作者	Sun, J.
中文摘要	PDMS is usually considered as a dielectric material and PDMS microchannel walls can be treated as an electrically insulated boundary. However, in certain layouts of microfluidic networks, electrical leakage through PDMS walls could significantly alter the electrical field in the microfluidic circuits, which must be carefully considered in microfluidic circuit design. We report on our experimental characterization of electrical leakage through PDMS microfluidic channel walls. Numerical modeling clearly disclosed the alteration of electrical field and electroosmotic velocity in the microfluidic channels because of the electrical leakage through the thin PDMS wall. In addition, we demonstrate that the electrical leakage through the PDMS channel wall can be used to realize trapping of individual particles at different locations inside the mcirofluidic channel by balancing the electroosmotic flow and electrophoretic migration of the particle. Copyright © 2008 by ASME.
收录类别	CPCI-S ; EI
会议网址	10.1115/IMECE2008-68079
会议录	ASME International Mechanical Engineering Congress and Exposition, Proceedings
语种	英语
ISBN号	9780791848746
WOS记录号	WOS:000266546900133
内容类型	会议论文
源URL	[http://dspace.imech.ac.cn/handle/311007/60452]
专题	力学研究所_非线性力学国家重点实验室
推荐引用方式 GB/T 7714	Sun JS,Vajandar SK,Xu DY,et al. Electrical leakage through thin PDMS microchannel walls and its applications[C]. 见:2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008. Boston, MA, United states. October 31, 2008 - November 6, 2008.10.1115/IMECE2008-68079.