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	Preparation and properties of carbon nanotubes reinforced Cu matrix composites for electronic packaging application
	Xu, L.S. ; Chen, X.H. ; Liu, X.J. ; Liu XJ(刘兴军)
	2013
关键词	Carbon nanotubes Composite materials Copper Electronics packaging Metallic matrix composites Reinforced plastics Reinforcement Thermal expansion
英文摘要	Conference Name:2012 International Conference on Applied Mechanics and Materials, ICAMM 2012. Conference Address: Sanya, China. Time:November 24, 2012 - November 25, 2012.; Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were prepared using a unique spherical MWCNT-implanted copper composite powders. The MWCNTs are homogenously 'locked' in the composite and tightly bonded to the matrix, which makes them play excellent reinforcement role on the microhardness compared with the unreinforced pure copper. Although the thermal conductivity is not enhanced for the thermal resistance between the carbon nanotubes and the copper matrix; it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the thermal expansion of the composites decreased apparently with the addition of the carbon nanotubes. ? (2013) Trans Tech Publications, Switzerland.
语种	英语
出处	http://dx.doi.org/10.4028/www.scientific.net/AMM.275-277.1789
出版者	Trans Tech Publications
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/85109]
专题	材料学院－会议论文
推荐引用方式 GB/T 7714	Xu, L.S.,Chen, X.H.,Liu, X.J.,et al. Preparation and properties of carbon nanotubes reinforced Cu matrix composites for electronic packaging application. 2013-01-01.

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