无铅镉化学镍沉积及其表征

CORC > 厦门大学 > 2010年第16卷

	无铅镉化学镍沉积及其表征; Electroless Deposition and Characterization of Nickel Coating in Lead-and Cadmium-free Bath
	杨防祖 ; 陈明辉 ; 黄夏菁 ; 田中群 ; 周绍民 ; YANG Fang-zu ; CHEN Ming-hui ; HUANG Xia-jing ; TIAN Zhong-qun ; ZHOU Shao-min
刊名	http://electrochem.xmu.edu.cn/CN/abstract/abstract8391.shtml
	2010-11-28
关键词	化学沉积镍无铅无镉形貌结构电化学活性 electroless deposition nickel lead-free cadmium-free morphology structure electrochemical activity
英文摘要	优化无铅、无镉化学镍沉积工艺,应用扫描电子显微镜(SEM)、能量色散谱(EDS)、X射线衍射(XRD)和电化学方法表征化学镀镍层的形貌、组成、结构和电化学活性.结果表明,化学镍自催化沉积速率为22.4μm.h-1;沉积速率随溶液温度和pH值的提高而增大;比之硫酸镍,次磷酸钠对沉积速率的影响明显许多.化学镀镍层磷含量为7.8%(by mass),结构致密、晶粒细小,呈非晶态结构.在NaCl溶液中,镀层呈现良好的电化学耐蚀性.; Technology of electroless nickel deposition in lead-and cadmium-free bath was developed.Coating′s morphology,composition,structure and electrochemical activity were characterized by SEM,EDS,XRD and electrochemical methods.The results showed that,the deposition rate of nickel in self-catalysing was 22.4 μm·h-1,which was increased by the increase of bath temperature and pH value.The effect of sodium hypophosphite on deposition rate was much more remarkable compared with nickel sulfate.The obtained nickel coating was 7.8% in phosphor weight content,having compact and neat surface morphology,amorphous structure,and good electrochemical corrosion resistance in sodium chloride solution.; 作者联系地址：厦门大学固体表面物理化学国家重点实验室化学化工学院;; Author's Address: State Key Laboratory of the Physical Chemistry of the Solid Surfaces,College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005
语种	中文
出版者	厦门大学《电化学》编辑部
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/58311]
专题	2010年第16卷
推荐引用方式 GB/T 7714	杨防祖,陈明辉,黄夏菁,等. 无铅镉化学镍沉积及其表征, Electroless Deposition and Characterization of Nickel Coating in Lead-and Cadmium-free Bath[J]. http://electrochem.xmu.edu.cn/CN/abstract/abstract8391.shtml,2010.
APA	杨防祖.,陈明辉.,黄夏菁.,田中群.,周绍民.,...&ZHOU Shao-min.(2010).无铅镉化学镍沉积及其表征.http://electrochem.xmu.edu.cn/CN/abstract/abstract8391.shtml.
MLA	杨防祖,et al."无铅镉化学镍沉积及其表征".http://electrochem.xmu.edu.cn/CN/abstract/abstract8391.shtml (2010).