硬质粒子扰动下铜电沉积研究

CORC > 厦门大学 > 2005年第11卷

	硬质粒子扰动下铜电沉积研究; Copper Electrodeposition Under the Perturbation of Hard Particles
	朱增伟 ; 朱荻 ; ZHU Zeng-wei ; ZHU Di
刊名	http://electrochem.xmu.edu.cn/CN/abstract/abstract8883.shtml
	2005-11-28
关键词	电沉积电铸旋转阴极硬质粒子铜 Electrodeposition Electroforming Rotating cathode Hard particle Copper
英文摘要	使用常规旋转电极电沉积技术,引入陶瓷球等一类硬质粒子,在旋转电极的带动下,使陶瓷球不断磨擦和撞击阴极表面而实现电铸铜.对比酸性溶液电铸铜和碱性溶液电铸铜,发现硬质粒子在电沉积过程中能扰动离子的放电过程,并影响电铸层的组织结构.但由于二者放电机理不同,前者形成的电铸层表面布满尖状毛刺,而后者则表面尖刺消失,但脆性大.SEM和XRD测试表明,由碱性电铸液沉积的电铸铜层,表面光亮平整,晶粒致密,大小约为100~300 nm,其结晶形态接近无序取向.; Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes.The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions.It was also found that brightening and smoothing deposit could be obtained from the alkaline solution,and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm.The results show that the polishing and impact of hard particles can effectively disturb the discharge of cations,simultaneously influence the microstructure of deposits.; 作者联系地址：南京航空航天大学特种加工研究中心,南京航空航天大学特种加工研究中心江苏南京210016,江苏南京210016; Author's Address: Research Center for Nontraditional Machining,Nanjing University of Aeronautics & Astronautics,Nanjing 210016,China
语种	中文
出版者	厦门大学《电化学》编辑部
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/57872]
专题	2005年第11卷
推荐引用方式 GB/T 7714	朱增伟,朱荻,ZHU Zeng-wei,等. 硬质粒子扰动下铜电沉积研究, Copper Electrodeposition Under the Perturbation of Hard Particles[J]. http://electrochem.xmu.edu.cn/CN/abstract/abstract8883.shtml,2005.
APA	朱增伟,朱荻,ZHU Zeng-wei,&ZHU Di.(2005).硬质粒子扰动下铜电沉积研究.http://electrochem.xmu.edu.cn/CN/abstract/abstract8883.shtml.
MLA	朱增伟,et al."硬质粒子扰动下铜电沉积研究".http://electrochem.xmu.edu.cn/CN/abstract/abstract8883.shtml (2005).