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	Subsurface damage detection and damage mechanism analysis of chemical-mechanical polished optics
	Ye, Hui ; Yang, Wei ; Bi, Guo ; Yang, Ping ; Guo, Yinbiao ; Yang W(杨炜) ; Bi G(毕果) ; Yang P(杨平) ; Guo YB(郭隐彪)
	2014
关键词	Chemical analysis Chemical detection Chemical mechanical polishing Chemical polishing Etching Manufacture Morphology Optical testing Polishing
英文摘要	Conference Name:7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, AOMATT 2014. Conference Address: Harbin, China. Time:April 26, 2014 - April 29, 2014.; Chinese Academy of Sciences, Institute of Optics and Electronics (IOE); Chinese Optical Society (COS); Detection of the subsurface damage depth in optical elements has significance on the subsequent material removal amount and improving element surface quality. The paper focuses on the subsurface damage of chemical-mechanical polished K9 specimen, and analyses the chemical-mechanical polishing mechanism and the cause of subsurface damage. A most suitable etchant is chosen and the step-by-step etching method is applied to measure the subsurface damage depth. A microscope is used to detect the damage morphology and the variation trend at different depth. Research shows that the subsurface damage caused by chemical-mechanical polishing is Hertz scratch, and the scratch quantity below surface presents a variation of zero-more-less-disappeared. The K9 specimen is polished for 3 min under the pressure of 2.5 Kgf and the spindle speed of 43139 r/min, thus resulting in a subsurface damage depth 15.3μm. ? 2014 SPIE.
语种	英语
出处	http://dx.doi.org/10.1117/12.2069273
出版者	SPIE
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/86290]
专题	物理技术－会议论文
推荐引用方式 GB/T 7714	Ye, Hui,Yang, Wei,Bi, Guo,et al. Subsurface damage detection and damage mechanism analysis of chemical-mechanical polished optics. 2014-01-01.

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