QQ客服 官方微博 反馈留言

	Comparison of glass etching properties between HCl and HNO3 solution
	Tao, Wei ; Lv, Wenlong ; Zhan, Zhan ; Zuo, Wenjia ; Qiu, Xiaochun ; Wang, Linyun ; Sun, Daoheng ; Sun DH(孙道恒)
	2012
英文摘要	Conference Name:7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012. Conference Address: Kyoto, Japan. Time:March 5, 2012 - March 8, 2012.; IEEE; IEEE Nanotechnology Council; The Murata Science Foundation; The Kyoto University Foundation; Office of Naval Research Global; A comparison of glass etching properties between HCl and HNO3 solution is presented in this paper, which allows us to predict the etched product's shape under a variety of etching conditions, mask compensation and multiple processing steps. Four conclusions could be draw from the experiments. First, the best concentration ratio of the etching solution to protect the mask from damage and get a channel with depth of 40 渭m is HF:HCl:NH 4F=5.5mol/L:4mol/L:2.5mol/L. Second, as the temperature increases, the longitudinal etching rate increases. However, the temperature has little influence on the lateral erosion ratio when the temperature gets high. Third, HCl has a better surface morphology against HNO3 as an addition to solution. Last, the mask will introduce strain because of sputtering, which is harmful to the glass etching. 漏 2012 IEEE.
语种	英语
出处	http://dx.doi.org/10.1109/NEMS.2012.6196838
出版者	IEEE Computer Society
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/86234]
专题	物理技术－会议论文
推荐引用方式 GB/T 7714	Tao, Wei,Lv, Wenlong,Zhan, Zhan,et al. Comparison of glass etching properties between HCl and HNO3 solution. 2012-01-01.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。