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	Research on the with-in wafer non-uniformity (WIWNU) of the large quadrate optic in the fast polishing process
	Guo Yinbiao ; Yang Wei ; Chen Zhen ; Peng Yunfeng ; Guo YB(郭隐彪) ; Yang W(杨炜) ; Peng YF(彭云峰)
	2010
关键词	CHEMICAL-MECHANICAL PLANARIZATION
英文摘要	Conference Name:13th International Symposium on Advances in Abrasive Technology/1st Cross-Strait Conference on Precision Machining. Conference Address: Taipei, TAIWAN. Time:SEP 19-22, 2010.; In this paper, the with-in-wafer non-uniformity (WIWNU) of the lager quadrate optic in the fast polishing process (FPP) is discussed from the machine side. At the machine side, the non-uniform stress on the wafer surface is the major reason for the non-uniform material removal rate which results in the WIWNU. Stresses arise manly from two sources, namely the :pressure exerted by the polishing pad and shear stress due to the relative motion between the wafer and pad. Based on the special chemical mechanical polishing FPP, the kinematic motion of the wafer is analyzed and the non-uniform stress is analyzed by a 3D axisymmetric quasi-static model. The WIWNU can be reduced by adjusting the stress.
语种	英语
出处	http://dx.doi.org/10.4028/www.scientific.net/AMR.125-128.475
出版者	ADV MATER RES-SWITZ
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/85994]
专题	物理技术－会议论文
推荐引用方式 GB/T 7714	Guo Yinbiao,Yang Wei,Chen Zhen,et al. Research on the with-in wafer non-uniformity (WIWNU) of the large quadrate optic in the fast polishing process. 2010-01-01.

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