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	STM tip induced local etching and deposition on Cu surfaces
	Xie, ZX ; Xie ZX(谢兆雄) ; Mao, BW ; Mao BW(毛秉伟) ; Tang, J ; Tang J(汤儆)
	1999
关键词	STM nano-etching nanodeposition Cu
英文摘要	At cathodic potential of bulk copper deposition in dilute Cu2+ solution, tip was found to be able to induce local dissolution of copper by applying a rather positive tip potential, although meanwhile the copper was still deposited on the surface far from the tip area, The more positive the tip potential or the electrode potential is, the faster induced dissolution rate is, At a rather negative tip potential, deposition of Cu was enhanced by the tip while in the case Cu was dissolved locally with a more positive tip potential. A mechanism based on overlap of double layers between tip and substrate was proposed.
语种	中文
出版者	HIGHER EDUCATION PRESS
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/13134]
专题	化学化工－已发表论文
推荐引用方式 GB/T 7714	Xie, ZX,Xie ZX,Mao, BW,et al. STM tip induced local etching and deposition on Cu surfaces[J],1999.
APA	Xie, ZX,谢兆雄,Mao, BW,毛秉伟,Tang, J,&汤儆.(1999).STM tip induced local etching and deposition on Cu surfaces..
MLA	Xie, ZX,et al."STM tip induced local etching and deposition on Cu surfaces".(1999).

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