Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys | |
Ohnuma, I. ; Miyashita, M. ; Anzai, K. ; Liu, X. J. ; Ohtani, H. ; Kainuma, R. ; Ishida, K. ; Liu XJ(刘兴军) | |
2000 | |
关键词 | phase diagrams thermodynamics database Pb-free solders computer simulation Sn-Ag-Cu based alloys solidification |
英文摘要 | We have recently developed a thermodynamic database for micro-soldering alloys which consists of the elements Pb, Bi, Sn, Sb, Cu, Ag, Zn, and In. In this paper, the phase equilibria and the related thermodynamic properties of the Sn-Ag-Cu base alloys are presented using this database, alloy systems being one of the promising candidates for Pb-free solders. The isothermal section diagrams of the Sn-Ag-Cu ternary system were experimentally determined by SEM-EDS, x-ray diffraction and metallographic techniques. Based on the present results as well as the previous data on phase boundaries and thermochemical properties, thermodynamic assessment of this system was carried out. The isothermal and vertical section diagrams, liquidus surface, mass fractions of the phase constitution, etc., were calculated. The predictions of surface energy and viscosity were also investigated. Moreover, a non-equilibrium solidification process using the Scheil model was simulated and compared with the equilibrium solidification behavior in some Sn-Ag-Cu base alloys. Calculated results based on the Scheil model were incorporated into a three-dimensional solidification simulation and the prediction of practical solidification procedures was performed. |
语种 | 英语 |
内容类型 | 期刊论文 |
源URL | [http://dspace.xmu.edu.cn/handle/2288/59162] ![]() |
专题 | 材料学院-已发表论文 |
推荐引用方式 GB/T 7714 | Ohnuma, I.,Miyashita, M.,Anzai, K.,et al. Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys[J],2000. |
APA | Ohnuma, I..,Miyashita, M..,Anzai, K..,Liu, X. J..,Ohtani, H..,...&刘兴军.(2000).Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys.. |
MLA | Ohnuma, I.,et al."Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys".(2000). |
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