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	Sn-Zn-Bi-In-P新型无铅焊料性能研究
	王正宏 ; 于红娇 ; 李胜明 ; 马莒生 ; 张弓 ; WANG Zhenghong ; YU Hongjiao ; LI Shengming ; MA Jusheng ; ZHANG Gong
	2016-03-30 ; 2016-03-30
关键词	无铅焊料 Sn-Zn-Bi-In-P 密度 熔点 线膨胀系数 电阻率 润湿角 lead-free Sn-Zn-Bi-In-P low melting point Anand constitutive equation TG42
其他题名	Property study of Sn-Zn-Bi-In-P lead-free solder
中文摘要	新型无铅焊料Sn-4.5Zn-2Bi-In-P、Sn-9Zn-2.5Bi-In-P具有优异的抗氧化、抗腐蚀性能,弥补了Sn-Zn系焊料润湿性能方面的不足,具有极大的实用性。测量了共晶Sn-9Zn、两种新型Sn-Zn系无铅焊料和传统的Sn-37Pb焊料的各项物理性能:密度、熔点、线膨胀系数、电阻率及对铜基体的润湿角。实验结果表明,新型Sn-Zn系无铅焊料的密度约为传统Sn-37Pb焊料的3/4;熔点(依次为194℃,191.9℃)接近Sn-37Pb焊料,熔程仅为8℃;在25~100℃,新型Sn-Zn焊料线膨胀系数依次为20.8×10–6/℃、16.9×10–6/℃,优于Sn-37Pb焊料(21.2×10–6/℃);新型Sn-Zn焊料的电阻率依次为1.73×10–6Ω·m、1.79×10–6Ω·m,优于Sn-37Pb焊料(1.96×10–6Ω·m);新型Sn-Zn焊料对Cu基体的润湿角接近30°,满足实用化的最低要求。; Due to the excellent oxidation resistance and corrosion resistance, which make up for the wet ability deficiency of Sn-Zn solder, new lead-free solder Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P have great practicability. The physical properties: density, melting point, linear expansion coefficient, resistivity and wetting angle on copper substrates of all four solders:Sn-9Zn, two new Sn-Zn lead-free solders and Sn-37 Pb were measured. Experiments show that, the density of new Sn-Zn lead-free solder is 3/4 of the density of Sn-37Pb; melting point(194 ℃, 191.9 ℃, respectively) is close to Sn-37 Pb, and melting range is only 8 ℃; during 25-100 ℃, the linear expansion coefficients of Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P are 20.8×10–6/ ℃, 16.9×10–6/ ℃, respectively, better than Sn-37Pb(21.2×10–6/ ℃); Resistivities of Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P are 1.73×10–6 Ω·m, 1.79×10–6 Ω·m, respectively, better than Sn-37Pb(1.96×10–6Ω · m); wetting angle on Cu substrate of two new Sn-Zn lead-free solder is about 30°,which meets the minimum requirements of practicability.
语种	中文 ; 中文
内容类型	期刊论文
源URL	[http://ir.lib.tsinghua.edu.cn/ir/item.do?handle=123456789/144482]
专题	清华大学
推荐引用方式 GB/T 7714	王正宏,于红娇,李胜明,等. Sn-Zn-Bi-In-P新型无铅焊料性能研究[J],2016, 2016.
APA	王正宏.,于红娇.,李胜明.,马莒生.,张弓.,...&ZHANG Gong.(2016).Sn-Zn-Bi-In-P新型无铅焊料性能研究..
MLA	王正宏,et al."Sn-Zn-Bi-In-P新型无铅焊料性能研究".(2016).

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