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	Temperature fields and strains in composite laminates during curing
	Li Jun ; Yao Xuefeng ; Liu Yinghua ; Kou Zhejun ; Dai Di
	2010-10-12 ; 2010-10-12
关键词	Theoretical or Mathematical/ curing heat conduction laminates/ temperature fields strains composite laminates curing one-dimensional transient heat conduction model Biot number Fourier number/ A8120 Other methods of preparation of materials
中文摘要	The curing of a composite laminate was modeled using a simplified one-dimensional transient heat conduction model. An analytical solution was derived for the temperature response of the composite laminate structure for typical curing conditions. The result relates the surplus temperature, the Biot number, and the Fourier number in a chart for the midplane of the part during the temperature holding and ramp stages. The strain field is then calculated from the temperature field. The results show that the maximum internal temperature is close to the surface during the temperature ramp stage, but is in the center during the holding stage.
语种	中文
出版者	Tsinghua University Press ; China
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/79218]
专题	清华大学
推荐引用方式 GB/T 7714	Li Jun,Yao Xuefeng,Liu Yinghua,et al. Temperature fields and strains in composite laminates during curing[J],2010, 2010.
APA	Li Jun,Yao Xuefeng,Liu Yinghua,Kou Zhejun,&Dai Di.(2010).Temperature fields and strains in composite laminates during curing..
MLA	Li Jun,et al."Temperature fields and strains in composite laminates during curing".(2010).

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