| Microstructural characterization of the Al/Cu/steel diffusion bonded joint | |
| Cheng Xiaole ; Bai Bingzhe ; Gao Yimin ; Feng Chun | |
| 2010-10-12 ; 2010-10-12 ; OCT | |
| 关键词 | metal composites diffusion bonding intermetallic compounds microhardness interface MECHANICAL-PROPERTIES TEMPERATURE Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering |
| 中文摘要 | A vacuum hot-pressed diffusion method was used to prepare an Al/Cu/steel composite with a gradient structure. The Al/Cu interface was investigated layer by layer by means of scanning electron microscopy, energy dispersive X-ray spectrometry, electron probe microanalysis, and Vickers microhardness. The results show that two kinds of intermetallic compounds, Cu9Al4 adjacent to the Cu side and CuAl2 adjacent to the Al side, are formed in the interface of Al/Cu. The conductivity is 0.369 mS/cm in the intermetallic compound with a thickness of 3.5 A mu m, higher than that of the intermetallic compound with a thickness of 23 A mu m, in which the conductivity is 0.242 mS/cm. |
| 语种 | 英语 ; 英语 |
| 出版者 | NONFERROUS METALS SOC CHINA ; BEIJING ; NO 30 XUEYUAN RD, BEIJING 100083, PEOPLES R CHINA |
| 内容类型 | 期刊论文 |
| 源URL | [http://hdl.handle.net/123456789/78192]  |
| 专题 | 清华大学 |
| 推荐引用方式 GB/T 7714 | Cheng Xiaole,Bai Bingzhe,Gao Yimin,et al. Microstructural characterization of the Al/Cu/steel diffusion bonded joint[J],2010, 2010, OCT. |
| APA | Cheng Xiaole,Bai Bingzhe,Gao Yimin,&Feng Chun.(2010).Microstructural characterization of the Al/Cu/steel diffusion bonded joint.. |
| MLA | Cheng Xiaole,et al."Microstructural characterization of the Al/Cu/steel diffusion bonded joint".(2010). |
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