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	自组装方法化学沉积NiMoP镀层研究
	刘璐 ; 杨志刚 ; 刘殿龙 ; 张弛 ; Liu Lu ; Yang Zhigang ; Liu Dianlong ; Zhang Chi
	2010-06-10 ; 2010-06-10
关键词	化学沉积 自组装层 NiMoP阻挡层 electroless deposition self-assembled monolayer (SAM) NiMoP barrier TQ153.2
其他题名	Study on Electroless Deposition NiMoP Layer by SAM
中文摘要	应用自组装膜吸附钯的活化方法,在SiO2/Si平面基板表面化学沉积NiMoP阻挡层。应用XRF、XRD、SEM以及四探针等方法探讨了镀液中钼酸根浓度、温度及pH值对NiMoP镀层的影响。结果表明,镀层中Mo与P含量互相制约;随钼酸钠浓度上升,化学镀NiMoP的沉积速度逐渐降低,镀层结构由非晶态向晶态转变,镀层电阻率降低;随镀液温度上升,NiMoP镀层的沉积速度逐渐升高;镀液pH值在一定范围内上升可提高NiMoP镀层的沉积速度,镀层的晶粒尺寸与沉积速度有相同的变化趋势。; Electroless deposition NiMoP barrier for Cu interconnects was prepared on SiO2/Si substrate by self-assembled monolayer (SAM) activated with PdCl2. The effects of MnO42- concentration, temperature and pH value on NiMoP layer were investigated by the methods of X-ray fluorescence (XRF), X-ray diffraction (XRD), scan electron microscope (SEM) and four-point probe. The experimental results indicate that Mo and P in the layer are restricted each other; as the content of MnO42- increases, the deposition rate increases, the film structure transforms from amorphous to crystal, and the layer resistivity decreases; as the temperature increases, the deposition rate increases; within a certain range of pH value, the deposition rate increases with the increase of pH value. The changes of the layer grain size and the deposition rate have the same trend.
语种	中文 ; 中文
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/61782]
专题	清华大学
推荐引用方式 GB/T 7714	刘璐,杨志刚,刘殿龙,等. 自组装方法化学沉积NiMoP镀层研究[J],2010, 2010.
APA	刘璐.,杨志刚.,刘殿龙.,张弛.,Liu Lu.,...&Zhang Chi.(2010).自组装方法化学沉积NiMoP镀层研究..
MLA	刘璐,et al."自组装方法化学沉积NiMoP镀层研究".(2010).

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