| 透明尖晶石陶瓷的高温性能和应用研究 | |
| 雷牧云 ; 李法荟 ; 闻芳 ; 汪志华 ; 李祯 ; 宋庆海 ; LEI Mu-yun ; LI Fa-hui ; WEN Fang ; WANG Zhi-hua ; LI Zhen ; SONG Qing-hai | |
| 2010-06-10 ; 2010-06-10 | |
| 关键词 | 透明陶瓷 尖晶石 高温性能 应用 transparent ceramic spinel high temperature performance application TQ174.1 |
| 其他题名 | Study on High Temperature Performance and Applications of Transparent Ceramic Spinel |
| 中文摘要 | 以高纯、超细的镁铝尖晶石粉末作为起始原料,采用真空热压烧结与热等静压法相结合制备透明尖晶石陶瓷材料(TMAC)。测试了TMAC材料的高温性能,并探讨其可能的应用。从室温到250℃,材料的抗弯强度没有发生明显的变化;从室温到900℃的热膨胀系数和电阻率测试结果表明该材料有良好的稳定性和电绝缘性能;经过从室温到1100℃的退火,TMAC的红外透过率和面形均未发生明显变化,表明材料有比较好的耐高温性能。; In this paper,transparent ceramic spinel was fabricated by hot pressing in vacuum combined with hot isostatic pressing(HIP).Highly pure ultra fine spinel powder was used as a starting material.Some high temperature performances were also measured.From room temperature to 250 ℃,the flexural strength did not have large change.And the results of the coefficient of thermal expansion and the conductivity from room temperature to 900 ℃ shows that TMAC has good stability and electrical insulation properties.After fired under the temperature of 1100 ℃,there isn't obvious change of the transmittance and mophores of the spinel,this indicates that the transparent spinel is a good IR window material which can resist the high temperature. |
| 语种 | 中文 ; 中文 |
| 内容类型 | 期刊论文 |
| 源URL | [http://hdl.handle.net/123456789/61152]  |
| 专题 | 清华大学 |
| 推荐引用方式 GB/T 7714 | 雷牧云,李法荟,闻芳,等. 透明尖晶石陶瓷的高温性能和应用研究[J],2010, 2010. |
| APA | 雷牧云.,李法荟.,闻芳.,汪志华.,李祯.,...&SONG Qing-hai.(2010).透明尖晶石陶瓷的高温性能和应用研究.. |
| MLA | 雷牧云,et al."透明尖晶石陶瓷的高温性能和应用研究".(2010). |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论