| 硅通孔互连技术的开发与应用 | |
| 封国强 ; 蔡坚 ; 王水弟 | |
| 2010-06-09 ; 2010-06-09 | |
| 关键词 | 硅通孔互连 三维封装 MEMS封装 through wafer interconnect 3D packaging MEMS packaging TN405 |
| 其他题名 | Development & Applications of Through Wafer Interconnect Technology |
| 中文摘要 | 随着三维叠层封装、MEMS封装、垂直集成传感器阵列以及台面MOS功率器件倒装焊技术的开发,硅通孔互连技术正在受到越来越广泛的重视和研究。本文叙述了几种硅通孔互连的制造方法,及其应用。最后,进一步阐述了硅通孔互连中几项关键技术的研究现状以及存在的挑战。; With the development of 3D packaging,MEMS packaging,vertical integrated sensor array and flip chip CSP for vertical power MOSFET,through wafer interconnect technology has been widely emphasized and researched.This paper described several fabrication methods of through wafer interconnect and their applications.Finally,the status and challenges of several key through wafer interconnect are further introduced. |
| 语种 | 中文 ; 中文 |
| 内容类型 | 期刊论文 |
| 源URL | [http://hdl.handle.net/123456789/56979]  |
| 专题 | 清华大学 |
| 推荐引用方式 GB/T 7714 | 封国强,蔡坚,王水弟. 硅通孔互连技术的开发与应用[J],2010, 2010. |
| APA | 封国强,蔡坚,&王水弟.(2010).硅通孔互连技术的开发与应用.. |
| MLA | 封国强,et al."硅通孔互连技术的开发与应用".(2010). |
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