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	铜片封装光纤光栅传感器的应变和温度传感特性研究
	于秀娟 ; 余有龙 ; 张敏 ; 廖延彪 ; 赖淑蓉 ; Yu Xiujuan ; Yu Yonglong ; Zhang Min ; Liao Y anbiao ; Lai Shurong
	2010-06-09 ; 2010-06-09
关键词	光纤Bragg光栅 封装工艺 应变传感 温度传感 Fiber Bragg grating Packaging technique Strain sensing Temperature sensing TP212.14
其他题名	Study on the Strain and Temperature Densing Characterist ics of FBG Packaged by the Copper slice
中文摘要	提出了一种光纤光栅的铜片封装工艺,并通过实验和理论分析研究了光纤光栅的应变和温度传感特性.与裸光纤光栅的测试结果相比,铜片封装工艺基本不改变光纤光栅应变传感的灵敏度,但是温度灵敏度系数提高了2.78倍.经过铜片封装后的光纤光栅可以探测到的应变和温度分别为1με和0.03℃,便于工程应用.; In this paper,the copper slice packaging technique fo r FBG sensor was developed in consideration of bare optical fiber being fragilit y,and then the strain and temperature characteristics of the packaged FBG sensor were experimentally and theoretically studied.Compared with the experimental re sults of the bare FBG,the strain sensing property of the FBG sensor packaged by the copper slice is nearly the same as that of the bare FBG,however the temperat ure sensing ability of the packaged FBG sensor is improved and the temperature s ensitivity coefficient is 2.78 times as much as that of the bare FBG.The strain and temperature resolution of the packaged FBG sensor are 1 με and 0.03℃.The packaged FBG sensors can be used easily in engineering.; 国家自然科学基金与中国节能投资公司联合研究基金(60177029); 国家863高技术计划(2001AA60201111)资助
语种	中文 ; 中文
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/54772]
专题	清华大学
推荐引用方式 GB/T 7714	于秀娟,余有龙,张敏,等. 铜片封装光纤光栅传感器的应变和温度传感特性研究[J],2010, 2010.
APA	于秀娟.,余有龙.,张敏.,廖延彪.,赖淑蓉.,...&Lai Shurong.(2010).铜片封装光纤光栅传感器的应变和温度传感特性研究..
MLA	于秀娟,et al."铜片封装光纤光栅传感器的应变和温度传感特性研究".(2010).

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