| 综合改善微细电解加工精度的工艺研究 | |
| 马晓宇 ; 李勇 ; 胡满红 ; 刘改红 ; Ma Xiaoyu ; Li Yong ; Hu Manhong ; Liu Gaihong | |
| 2010-06-08 ; 2010-06-08 | |
| 关键词 | 微细电解加工 加工精度 电场约束 间歇回退 micro ECM machining accuracy electric field confinement intermittent withdrawal TG662 |
| 其他题名 | Research on Improvement of Accuracy of Micro ECM with Multitechnique Integration |
| 中文摘要 | 电解加工的阳极电化学溶解原理使其在微细加工领域具有巨大的发展潜力,但杂散腐蚀和流场条件恶劣制约加工精度的提高。分析了影响微细电解加工的主要因素,提出综合改善微细电解加工精度的工艺途径。理论分析和实验研究均表明:将LIGA工艺制备高质量微细阵列电极、电极侧壁绝缘、高频脉冲电流及非线性电解液加工、电极间歇回退伺服控制等方法有机结合,能有效约束电场、改善流场,提高微细电解加工的精度。; The electrochemical machining(ECM) has great potential in micro and precision manufacturing fields due to its processing principle of anodic dissolution,but the practical machining accuracy of micro ECM is hampered by stray current and harsh flow field conditions in the micro machining gap.The predominant influencing factors in micro ECM were analyzed,and a comprehensive technical way was proposed to improve the machining performance,which integrated preparing high quality array electrode by LIGA process,side insulating of electrode,applying high frequency pulsed power,using passivating electrolyte and controlling the withdrawal of electrode intermittently.The theoretical and experimental investigation indicated that better accuracy can be achieved owing to the confinement of electric field and improvement of flow conditions.; 国家高技术研究发展计划资助项目(2006AA04Z317) |
| 语种 | 中文 ; 中文 |
| 内容类型 | 期刊论文 |
| 源URL | [http://hdl.handle.net/123456789/49879]  |
| 专题 | 清华大学 |
| 推荐引用方式 GB/T 7714 | 马晓宇,李勇,胡满红,等. 综合改善微细电解加工精度的工艺研究[J],2010, 2010. |
| APA | 马晓宇.,李勇.,胡满红.,刘改红.,Ma Xiaoyu.,...&Liu Gaihong.(2010).综合改善微细电解加工精度的工艺研究.. |
| MLA | 马晓宇,et al."综合改善微细电解加工精度的工艺研究".(2010). |
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