干接触体滑动过程温度场的计算 | |
陈辉 ; 胡元中 ; 王慧 ; 王文中 ; CHEN Hui ; HU Yuanzhong ; WANG Hui ; WANG Wenzhong | |
2010-06-08 ; 2010-06-08 | |
关键词 | 温度场 干接触 接触压力 影响因数 temperature field dry contact contact pressure influence coefficient TK123 |
其他题名 | Calculation of temperature fields of bodies in sliding contact without lubrication |
中文摘要 | 该文建立无润滑条件下滑动接触模型,考察相对滑动过程中摩擦热的产生以及传导,并研究了工程实际中对胶合、磨损、局部塑性变形有重要影响的局部温升。利用快速Fourier变换,求解L ap lace热传导方程,获得了光滑及粗糙表面的瞬时温升,以及接触体的体内各离散点的温度,从而得到半无限体干接触的温度场。结果表明:局部接触压力和摩擦因数以及相对滑动速度是和摩擦热直接相关的3个参数,在相同载荷下的粗糙峰表面接触处的瞬时温升远高于光滑表面接触处的温升。; A model was established to predict the frictional heat generation and conduction for bodies in sliding contact without lubrication to calculate the local temperature rise that greatly influences the glue,wear,and local plastic deformation.Fast Fourier transforms were used to solve the Laplacian equation of heat conduction.The analysis predicted the transient temperature rises of smooth and rough surfaces and the temperatures of discrete points in the half-infinite bodies in contact without lubrication.The results indicate that the frictional heat generation and thermal conduction are directly related to the local contact pressure,friction coefficient,and relative sliding speed.The results also show that the transient temperature rise of a rough surface is much higher than that of a smooth surface for the same load.; 美国GM公司资助项目(0410A58) |
语种 | 中文 ; 中文 |
内容类型 | 期刊论文 |
源URL | [http://hdl.handle.net/123456789/49729] ![]() |
专题 | 清华大学 |
推荐引用方式 GB/T 7714 | 陈辉,胡元中,王慧,等. 干接触体滑动过程温度场的计算[J],2010, 2010. |
APA | 陈辉.,胡元中.,王慧.,王文中.,CHEN Hui.,...&WANG Wenzhong.(2010).干接触体滑动过程温度场的计算.. |
MLA | 陈辉,et al."干接触体滑动过程温度场的计算".(2010). |
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