Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method

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	Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method
	Bai YL(白以龙); Wang HY(汪海英); Wang HY(汪海英)
刊名	力学学报
	2002
卷号	34 期号:3 页码:535-540
ISSN号	0459-1879
中文摘要	介绍一种可用于微电子封装局部应变场分析的实验/计算混合方法,该方法结合了有限元的整体/局部模型和实时的激光云纹干涉技术,利用激光云纹干涉技术所测得的应变场来校核有限元整体模型的计算结果,并用整体模型的结果作为局部模型的边界条件,对实验难以确定的封装结构局部位置的应力、应变场进行分析.用这种方法对可控坍塌倒装封装结构在热载荷作用下焊球内的应变场分布进行了分析,结果表明该方法能够提供封装结构内应力-应变场分布的准确和可靠的结果,为微电子封装的可靠性分析提供重要的依据. For the reliability analysis of electronic packages, strains in very localized areas, such as an interconnection or a corner, need to be determined. In this paper, a modified hybrid method of global/local modeling and real time moire interferometry is presented. In this method, a simplified, coarsely meshed global model is developed to get rough information about the deformation of the microelectronic package. In order to make sure the global model has been reasonably simplified and the material properties ...
学科主题	力学
收录类别	其他
公开日期	2007-06-15 ; 2007-12-05 ; 2009-06-23
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/16598]
专题	力学研究所_力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Bai YL,Wang HY,Wang HY. Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method[J]. 力学学报,2002,34(3):535-540.
APA	白以龙,汪海英,&汪海英.(2002).Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method.力学学报,34(3),535-540.
MLA	白以龙,et al."Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method".力学学报 34.3(2002):535-540.